CORE TECHNOLOGY CO., LTD.

About CORE

Our mission is to provide high-performance and full-temperature-range packaging and testing solutions for the global semiconductor industry.
We firmly believe that continuous technological innovation and system integration are the keys to helping our clients accelerate product development. This enables diverse applications and sustainable progress for advanced chips used in artificial intelligence and graphics. It drives the intelligent world of tomorrow.

CoWoS Advanced Testing Equipment

We provide research, design and manufacturing services for back-end testing handlers and active temperature control systems. Our thermal control performance exceeds industry standards by more than twice. The systems are equipped with intelligent automated loading and unloading functions. They also feature an integrated logistics automation system.

Handler Design and Manufacturing

We offer multiple handler testing solutions. They support diverse fixture integrations. These designs enhance testing efficiency and product quality.

Advanced Thermal Control (ATC) Development

We develop integrated thermal control grippers. They ensure a stable temperature during the entire testing process. They are ideal for high-precision chip testing applications.

Integrated Packaging Test Solutions

From design to manufacturing, we provide one-stop back-end testing and packaging inspection solutions. We enhance production line integration efficiency.

Building Long-Term Partnerships on Trust

ESTABLISHING ENDURING PARTNERSHIPS BUILT ON TRUST.

With a solid foundation in mechanical engineering and integration capabilities, we have expanded into the semiconductor equipment field. We are committed to becoming a trusted and reliable partner in the global industry.